Crispy

Wafers

Ingredion Ingredients Used: N-DULGE 811 - 06450D00

Formulation Instructions

Formula

-

Ingredient %
Water 61.00
Flour, wheat 37.17
N-DULGE® 811 Starch 0.95
Oil, palm 0.57
Salt 0.15
Lecithin, soy 0.08
Sodium bicarbonate 0.08
TOTAL 100

Preparation

  1. Heat wafer iron plate to 180°C (top temperature) and 185°C (bottom temperature).
  2. Mix lecithin with vegetable oil.
  3. Dissolve sodium bicarbonate in water.
  4. Dry blend and sieve remaining dry ingredients.
  5. Mix all dry ingredients at low speed for 1 minute.
  6. Add sodium bicarbonate solution.
  7. Add lecithin-oil blend.
  8. Increase to medium speed and mix for 10 minutes. Sieve the batter.
  9. Pour 120g of batter onto wafer plate.
  10. Cook for 2 minutes.
  11. Cool down the wafer sheet and apply desired cream filling.
  12. Cut into desired shape.

Formulation hints and help

Starch gelatinises very quickly in the baking process that is primarily responsible for the structure integrity of the wafer sheet.

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